In the research and development of electronic components and materials, product development cycle time has been reduced in order to meet the demand from end users. In accordance with this trend, more emphasis is being placed on improving the efficiency of temperature characteristic evaluation, which plays a major role in ensuring end- product reliability and performance. This application note introduces an efficient and highly reliable measurement system (shown in Figure 1) for evaluating temperature characteristics of components and materials using a combination of the E4991A-007, Temperature Characteristics Test Kit, with an ESPEC1 bench-top temperature chamber (SU-261).