| 简称 | 英文全称 | 中文解释 |
| SMT | Surface Mounted Technology | 表面贴装技术 |
| SMD | Surface Mount Device | 表面安装设备(元件) |
| DIP | Dual In-line Package | 双列直插封装 |
| QFP | Quad Flat Package | 四边引出扁平封装 |
| PQFP | Plastic Quad Flat Package | 塑料四边引出扁平封装 |
| SQFP | Shorten Quad Flat Package | 缩小型细引脚间距QFP |
| BGA | Ball Grid Array Package | 球栅阵列封装 |
| PGA | Pin Grid Array Package | 针栅阵列封装 |
| CPGA | Ceramic Pin Grid Array | 陶瓷针栅阵列矩阵 |
| PLCC | Plastic Leaded Chip Carrier | 塑料有引线芯片载体 |
| CLCC | Ceramic Leaded Chip Carrier | 塑料无引线芯片载体 |
| SOP | Small Outline Package | 小尺寸封装 |
| TSOP | Thin Small Outline Package | 薄小外形封装 |
| SOT | Small Outline Transistor | 小外形晶体管 |
| SOJ | Small Outline J-lead Package | J形引线小外形封装 |
| SOIC | Small Outline Integrated Circuit Package | 小外形集成威廉希尔官方网站
封装 |
| MCM | Multil Chip Carrier | 多芯片组件 |
| MELF | | 圆柱型无脚元件 |
| D | Diode | 二极管 |
| R | Resistor | 电阻 |
| SOC | System On Chip | 系统级芯片 |
| CSP | Chip Size Package | 芯片尺寸封装 |
| COB | Chip On Board | 板上芯片 |
更多回帖
