您好!
我们计划在董事会上进行双重回流(CX3)。
回流焊温度曲线给出了数据表,但不写如果组件可以站多回流。
有什么已知的问题吗?
谢谢您!
最好的问候,
本杰明
以上来自于百度翻译
以下为原文
Hi
We plan to have a double reflow on our board (with a CX3).
Reflow profile is given in datasheet, but it is not written if the component can stand mul
tiple reflow.
Is there any known issue ?
Thank you !
Best regards,
Benjamin