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u*** 3.0标准规范下载 -(完整版)

u*** 3.0标准规范下载 -(完整版)
Universal Serial Bus 3.0
Specification
Hewlett-Packard Company
Intel Corporation
Microsoft Corporation
NEC Corporation
ST-NXP Wireless
Texas Instruments
1 Introduction ................................................................................................. 1-1
1.1 Motivation .................................................................................................................1-1
1.2 Objective of the Specification ...................................................................................1-2
1.3 Scope of the Document............................................................................................1-2
1.4 USB Product Compliance.........................................................................................1-2
1.5 Document Organization............................................................................................1-3
1.6 Design Goals............................................................................................................1-3
1.7 Related Documents..................................................................................................1-3
2 Terms and Abbreviations ........................................................................... 2-1
3 USB 3.0 Architectural Overview................................................................. 3-1
3.1 USB 3.0 System Description ....................................................................................3-1
3.1.1 USB 3.0 Physical Interface.....................................................................3-2
3.1.1.1 USB 3.0 Mechanical........................................................3-2
3.1.2 USB 3.0 Power .......................................................................................3-3
3.1.3 USB 3.0 System Configuration...............................................................3-3
3.1.4 USB 3.0 Architecture Summary..............................................................3-3
3.2 SuperSpeed Architecture .........................................................................................3-4
3.2.1 Physical Layer ........................................................................................3-5
3.2.2 Link Layer ...............................................................................................3-6
3.2.3 Protocol Layer.........................................................................................3-7
3.2.4 Robustness.............................................................................................3-8
3.2.4.1 Error Detection ................................................................3-8
3.2.4.2 Error Handling .................................................................3-9
3.2.5 SuperSpeed Power Management...........................................................3-9
3.2.6 Devices.................................................................................................3-10
3.2.6.1 Peripheral Devices ........................................................3-10
3.2.6.2 Hubs..............................................................................3-11
3.2.7 Hosts ....................................................................................................3-12
3.2.8 Data Flow Models.................................................................................3-12
4. SuperSpeed Data Flow Model.................................................................... 4-1
4.1 Implementer Viewpoints ...........................................................................................4-1
4.2 SuperSpeed Communication Flow...........................................................................4-1
4.2.1 Pipes.......................................................................................................4-2
4.3 SuperSpeed Protocol Overview ...............................................................................4-2
4.3.1 Differences from USB 2.0.......................................................................4-2
4.3.1.1 Comparing USB 2.0 and SuperSpeed Transactions.......4-3
4.3.1.2 Introduction to SuperSpeed Packets...............................4-4
4.4 Generalized Transfer Description.............................................................................4-4
4.4.1 Data Bursting..........................................................................................4-5
4.4.2 IN Transfers............................................................................................4-5
4.4.3 OUT Transfers........................................................................................4-6
4.4.4 Power Management and Performance...................................................4-7
4.4.5 Control Transfers....................................................................................4-8
4.4.5.1 Control Transfer Packet Size ..........................................4-8
4.4.5.2 Control Transfer Bandwidth Requirements .....................4-8
4.4.5.3 Control Transfer Data Sequences...................................4-9
4.4.6 Bulk Transfers.........................................................................................4-9
4.4.6.1 Bulk Transfer Data Packet Size ......................................4-9
4.4.6.2 Bulk Transfer Bandwidth Requirements........................4-10
4.4.6.3 Bulk Transfer Data Sequences .....................................4-10
4.4.6.4 Bulk Streams.................................................................4-11
4.4.7 Interrupt Transfers ................................................................................4-12
4.4.7.1 Interrupt Transfer Packet Size ......................................4-13
4.4.7.2 Interrupt Transfer Bandwidth Requirements .................4-13
4.4.7.3 Interrupt Transfer Data Sequences...............................4-14
4.4.8 Isochronous Transfers..........................................................................4-14
4.4.8.1 Isochronous Transfer Packet Size ................................4-15
4.4.8.2 Isochronous Transfer Bandwidth Requirements ...........4-15
4.4.8.3 Isochronous Transfer Data Sequences.........................4-16
4.4.9 Device Notifications ..............................................................................4-16
4.4.10 Reliability ..............................................................................................4-16
4.4.10.1 Physical Layer...............................................................4-16
4.4.10.2 Link Layer......................................................................4-16
4.4.10.3 Protocol Layer ...............................................................4-17
4.4.11 Efficiency ..............................................................................................4-17
5 Mechanical ................................................................................................... 5-1
5.1 Objective ..................................................................................................................5-1
5.2 Significant Features..................................................................................................5-1
5.2.1 Connectors .............................................................................................5-1
5.2.1.1 USB 3.0 Standard-A Connector ......................................5-2
5.2.1.2 USB 3.0 Standard-B Connector ......................................5-2
5.2.1.3 USB 3.0 Powered-B Connector ......................................5-2
5.2.1.4 USB 3.0 Micro-B Connector............................................5-2
5.2.1.5 USB 3.0 Micro-AB and USB 3.0 Micro-A Connectors.....5-3
5.2.2 Compliant Cable Assemblies..................................................................5-3
5.2.3 Raw Cables ............................................................................................5-3
5.3 Connector Mating Interfaces ....................................................................................5-4
5.3.1 USB 3.0 Standard-A Connector..............................................................5-4
5.3.1.1 Interface Definition ..........................................................5-4
5.3.1.2 Pin Assignments and Description .................................5-14
5.3.1.3 USB 3.0 Standard-A Connector Color Coding ..............5-14
5.3.2 USB 3.0 Standard-B Connector............................................................5-15
5.3.2.1 Interface Definition ........................................................5-15
5.3.2.2 Pin Assignments and Description .................................5-20
5.3.3 USB 3.0 Powered-B Connector............................................................5-20
5.3.3.1 Interface Definition ........................................................5-20
5.3.3.2 Pin Assignments and Descriptions................................5-25
5.3.4 USB 3.0 Micro Connector Family .........................................................5-25
5.3.4.1 Interfaces Definition ......................................................5-25
5.3.4.2 Pin Assignments and Description .................................5-33
5.4 Cable Construction and Wire Assignments............................................................5-35
5.4.1 Cable Construction ...............................................................................5-35
5.4.2 Wire Assignments.................................................................................5-36
5.4.3 Wire Gauges and Cable Diameters ......................................................5-36
5.5 Cable Assemblies...................................................................................................5-37
5.5.1 USB 3.0 Standard-A to USB 3.0 Standard-B Cable Assembly.............5-37
5.5.2 USB 3.0 Standard-A to USB 3.0 Standard-A Cable Assembly.............5-38
5.5.3 USB 3.0 Standard-A to USB 3.0 Micro-B Cable Assembly ..................5-39
5.5.4 USB 3.0 Micro-A to USB 3.0 Micro-B Cable Assembly ........................5-41
5.5.5 USB 3.0 Micro-A to USB 3.0 Standard-B Cable Assembly ..................5-43
5.5.6 USB 3.0 Icon Location..........................................................................5-44
5.5.7 Cable Assembly Length........................................................................5-45
5.6 Electrical Requirements .........................................................................................5-46
5.6.1 SuperSpeed Electrical Requirements...................................................5-46
5.6.1.1 Raw Cable.....................................................................5-46
5.6.1.1.1 Characteristic Impedance.........................................5-46
5.6.1.1.2 Intra-Pair Skew.........................................................5-46
5.6.1.1.3 Differential Insertion Loss.........................................5-47
5.6.1.2 Mated Connector...........................................................5-47
5.6.1.3 Mated Cable Assemblies ..............................................5-48
5.6.1.3.1 Differential Insertion Loss (EIA-360-101) .................5-49
5.6.1.3.2 Differential Near-End Crosstalk between
SuperSpeed Pairs (EIA-360-90)........................5-50
5.6.1.3.3 Differential Crosstalk between D+/D- and
SuperSpeed Pairs (EIA-360-90)........................5-51
5.6.1.3.4 Differential-to-Common-Mode Conversion...............5-52
5.6.2 DC Electrical Requirements..................................................................5-52
5.6.2.1 Low Level Contact Resistance (EIA 364-23B) ..............5-52
5.6.2.2 Dielectric Strength (EIA 364-20) ...................................5-52
5.6.2.3 Insulation Resistance (EIA 364-21)...............................5-53
5.6.2.4 Contact Current Rating (EIA 364-70, Method 2) ...........5-53
5.7 Mechanical and Environmental Requirements.......................................................5-53
5.7.1 Mechanical Requirements ....................................................................5-53
5.7.1.1 Insertion Force (EIA 364-13).........................................5-53
5.7.1.2 Extraction Force (EIA 364-13).......................................5-53
5.7.1.3 Durability or Insertion/Extraction Cycles (EIA 364-09) ..5-53
5.7.1.4 Cable Flexing (EIA 364-41, Condition I)........................5-54
5.7.1.5 Cable Pull-Out (EIA 364-38, Condition A).....................5-54
5.7.1.6 Peel Strength (USB 3.0 Micro Connector
Family Only) ..................................................................5-54
5.7.1.7 4-Axes Continuity Test (USB 3.0 Micro Connector
Family Only) ..................................................................5-54
5.7.1.8 Wrenching Strength (Reference, USB 3.0 Micro
Connector Family Only) ................................................5-56
5.7.1.9 Lead Co-Planarity .........................................................5-56
5.7.1.10 Solderability...................................................................5-56
5.7.1.11 Restriction of Hazardous Substances (RoHS)
Compliance ...................................................................5-56
5.7.2 Environmental Requirements ...............................................................5-56
5.7.3 Materials ...............................................................................................5-57
5.8 Implementation Notes and Design Guides.............................................................5-57
5.8.1 Mated Connector Dimensions ..............................................................5-57
5.8.2 EMI Management .................................................................................5-60
5.8.3 Stacked Connectors .............................................................................5-60
6 Physical Layer ............................................................................................. 6-1
6.1 Physical Layer Overview ..........................................................................................6-1
6.2 Physical Layer Functions .........................................................................................6-1
6.2.1 Measurement Overview..........................................................................6-4
6.2.2 Channel Overview ..................................................................................6-5
6.3 Symbol Encoding .....................................................................................................6-5
6.3.1 Serialization and Deserialization of Data................................................6-6
6.3.2 Normative 8b/10b Decode Rules............................................................6-6
6.3.3 Data Scrambling .....................................................................................6-6
6.3.4 8b/10b Decode Errors.............................................................................6-7
6.3.5 Special Symbols for Framing and Link Management .............................6-8
6.4 Link Initialization and Training ..................................................................................6-8
6.4.1 Normative Training Sequence Rules......................................................6-9
6.4.1.1 Training Control Bits........................................................6-9
6.4.1.2 Training Sequence Values ..............................................6-9
6.4.2 Lane Polarity Inversion .........................................................................6-11
6.4.3 Elasticity Buffer and SKP Ordered Set .................................................6-11
6.4.4 Compliance Pattern ..............................................................................6-12
6.5 Clock and Jitter.......................................................................................................6-13
6.5.1 Informative Jitter Budgeting ..................................................................6-13
6.5.2 Normative Clock Recovery Function ....................................................6-14
6.5.3 Normative Spread Spectrum Clocking (SSC).......................................6-16
6.5.4 Normative Slew Rate Limit ...................................................................6-16
6.6 Signaling.................................................................................................................6-17
6.6.1 Eye Diagrams .......................................................................................6-17
6.6.2 Voltage Level Definitions ......................................................................6-18
6.6.3 Tx and Rx Input Parasitics....................................................................6-19
6.7 Transmitter Specifications ......................................................................................6-20
6.7.1 Transmitter Electrical Parameters ........................................................6-20
6.7.2 Low Power Transmitter.........................................................................6-21
6.7.3 Transmitter Eye ....................................................................................6-22
6.7.4 Tx Compliance Reference Receiver Equalize Function .......................6-22
6.7.5 Informative Transmitter De-emphasis...................................................6-23
6.7.6 Entry into Electrical Idle, U1..................................................................6-23
6.8 Receiver Specifications ..........................................................................................6-24
6.8.1 Receiver Equalization Training.............................................................6-24
6.8.2 Informative Receiver CTLE Function....................................................6-24
6.8.3 Receiver Electrical Parameters ............................................................6-26
6.8.4 Receiver Loopback...............................................................................6-27
6.8.4.1 Loopback BERT............................................................6-27
6.8.5 Normative Receiver Tolerance Compliance Test .................................6-29
6.9 Low Frequency Periodic Signaling (LFPS).............................................................6-30
6.9.1 LFPS Signal Definition..........................................................................6-30




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回帖（8）

电子发烧友

2009-4-12 00:17:04
u*** 3.0标准规范下载 -(完整版)
Universal Serial Bus 3.0
Specification
Hewlett-Packard Company
Intel Corporation
Microsoft Corporation
NEC Corporation
ST-NXP Wireless
Texas Instruments
1 Introduction ................................................................................................. 1-1
1.1 Motivation .................................................................................................................1-1
1.2 Objective of the Specification ...................................................................................1-2
1.3 Scope of the Document............................................................................................1-2
1.4 USB Product Compliance.........................................................................................1-2
1.5 Document Organization............................................................................................1-3
1.6 Design Goals............................................................................................................1-3
1.7 Related Documents..................................................................................................1-3
2 Terms and Abbreviations ........................................................................... 2-1
3 USB 3.0 Architectural Overview................................................................. 3-1
3.1 USB 3.0 System Description ....................................................................................3-1
3.1.1 USB 3.0 Physical Interface.....................................................................3-2
3.1.1.1 USB 3.0 Mechanical........................................................3-2
3.1.2 USB 3.0 Power .......................................................................................3-3
3.1.3 USB 3.0 System Configuration...............................................................3-3
3.1.4 USB 3.0 Architecture Summary..............................................................3-3
3.2 SuperSpeed Architecture .........................................................................................3-4
3.2.1 Physical Layer ........................................................................................3-5
3.2.2 Link Layer ...............................................................................................3-6
3.2.3 Protocol Layer.........................................................................................3-7
3.2.4 Robustness.............................................................................................3-8
3.2.4.1 Error Detection ................................................................3-8
3.2.4.2 Error Handling .................................................................3-9
3.2.5 SuperSpeed Power Management...........................................................3-9
3.2.6 Devices.................................................................................................3-10
3.2.6.1 Peripheral Devices ........................................................3-10
3.2.6.2 Hubs..............................................................................3-11
3.2.7 Hosts ....................................................................................................3-12
3.2.8 Data Flow Models.................................................................................3-12
4. SuperSpeed Data Flow Model.................................................................... 4-1
4.1 Implementer Viewpoints ...........................................................................................4-1
4.2 SuperSpeed Communication Flow...........................................................................4-1
4.2.1 Pipes.......................................................................................................4-2
4.3 SuperSpeed Protocol Overview ...............................................................................4-2
4.3.1 Differences from USB 2.0.......................................................................4-2
4.3.1.1 Comparing USB 2.0 and SuperSpeed Transactions.......4-3
4.3.1.2 Introduction to SuperSpeed Packets...............................4-4
4.4 Generalized Transfer Description.............................................................................4-4
4.4.1 Data Bursting..........................................................................................4-5
4.4.2 IN Transfers............................................................................................4-5
4.4.3 OUT Transfers........................................................................................4-6
4.4.4 Power Management and Performance...................................................4-7
4.4.5 Control Transfers....................................................................................4-8
4.4.5.1 Control Transfer Packet Size ..........................................4-8
4.4.5.2 Control Transfer Bandwidth Requirements .....................4-8
4.4.5.3 Control Transfer Data Sequences...................................4-9
4.4.6 Bulk Transfers.........................................................................................4-9
4.4.6.1 Bulk Transfer Data Packet Size ......................................4-9
4.4.6.2 Bulk Transfer Bandwidth Requirements........................4-10
4.4.6.3 Bulk Transfer Data Sequences .....................................4-10
4.4.6.4 Bulk Streams.................................................................4-11
4.4.7 Interrupt Transfers ................................................................................4-12
4.4.7.1 Interrupt Transfer Packet Size ......................................4-13
4.4.7.2 Interrupt Transfer Bandwidth Requirements .................4-13
4.4.7.3 Interrupt Transfer Data Sequences...............................4-14
4.4.8 Isochronous Transfers..........................................................................4-14
4.4.8.1 Isochronous Transfer Packet Size ................................4-15
4.4.8.2 Isochronous Transfer Bandwidth Requirements ...........4-15
4.4.8.3 Isochronous Transfer Data Sequences.........................4-16
4.4.9 Device Notifications ..............................................................................4-16
4.4.10 Reliability ..............................................................................................4-16
4.4.10.1 Physical Layer...............................................................4-16
4.4.10.2 Link Layer......................................................................4-16
4.4.10.3 Protocol Layer ...............................................................4-17
4.4.11 Efficiency ..............................................................................................4-17
5 Mechanical ................................................................................................... 5-1
5.1 Objective ..................................................................................................................5-1
5.2 Significant Features..................................................................................................5-1
5.2.1 Connectors .............................................................................................5-1
5.2.1.1 USB 3.0 Standard-A Connector ......................................5-2
5.2.1.2 USB 3.0 Standard-B Connector ......................................5-2
5.2.1.3 USB 3.0 Powered-B Connector ......................................5-2
5.2.1.4 USB 3.0 Micro-B Connector............................................5-2
5.2.1.5 USB 3.0 Micro-AB and USB 3.0 Micro-A Connectors.....5-3
5.2.2 Compliant Cable Assemblies..................................................................5-3
5.2.3 Raw Cables ............................................................................................5-3
5.3 Connector Mating Interfaces ....................................................................................5-4
5.3.1 USB 3.0 Standard-A Connector..............................................................5-4
5.3.1.1 Interface Definition ..........................................................5-4
5.3.1.2 Pin Assignments and Description .................................5-14
5.3.1.3 USB 3.0 Standard-A Connector Color Coding ..............5-14
5.3.2 USB 3.0 Standard-B Connector............................................................5-15
5.3.2.1 Interface Definition ........................................................5-15
5.3.2.2 Pin Assignments and Description .................................5-20
5.3.3 USB 3.0 Powered-B Connector............................................................5-20
5.3.3.1 Interface Definition ........................................................5-20
5.3.3.2 Pin Assignments and Descriptions................................5-25
5.3.4 USB 3.0 Micro Connector Family .........................................................5-25
5.3.4.1 Interfaces Definition ......................................................5-25
5.3.4.2 Pin Assignments and Description .................................5-33
5.4 Cable Construction and Wire Assignments............................................................5-35
5.4.1 Cable Construction ...............................................................................5-35
5.4.2 Wire Assignments.................................................................................5-36
5.4.3 Wire Gauges and Cable Diameters ......................................................5-36
5.5 Cable Assemblies...................................................................................................5-37
5.5.1 USB 3.0 Standard-A to USB 3.0 Standard-B Cable Assembly.............5-37
5.5.2 USB 3.0 Standard-A to USB 3.0 Standard-A Cable Assembly.............5-38
5.5.3 USB 3.0 Standard-A to USB 3.0 Micro-B Cable Assembly ..................5-39
5.5.4 USB 3.0 Micro-A to USB 3.0 Micro-B Cable Assembly ........................5-41
5.5.5 USB 3.0 Micro-A to USB 3.0 Standard-B Cable Assembly ..................5-43
5.5.6 USB 3.0 Icon Location..........................................................................5-44
5.5.7 Cable Assembly Length........................................................................5-45
5.6 Electrical Requirements .........................................................................................5-46
5.6.1 SuperSpeed Electrical Requirements...................................................5-46
5.6.1.1 Raw Cable.....................................................................5-46
5.6.1.1.1 Characteristic Impedance.........................................5-46
5.6.1.1.2 Intra-Pair Skew.........................................................5-46
5.6.1.1.3 Differential Insertion Loss.........................................5-47
5.6.1.2 Mated Connector...........................................................5-47
5.6.1.3 Mated Cable Assemblies ..............................................5-48
5.6.1.3.1 Differential Insertion Loss (EIA-360-101) .................5-49
5.6.1.3.2 Differential Near-End Crosstalk between
SuperSpeed Pairs (EIA-360-90)........................5-50
5.6.1.3.3 Differential Crosstalk between D+/D- and
SuperSpeed Pairs (EIA-360-90)........................5-51
5.6.1.3.4 Differential-to-Common-Mode Conversion...............5-52
5.6.2 DC Electrical Requirements..................................................................5-52
5.6.2.1 Low Level Contact Resistance (EIA 364-23B) ..............5-52
5.6.2.2 Dielectric Strength (EIA 364-20) ...................................5-52
5.6.2.3 Insulation Resistance (EIA 364-21)...............................5-53
5.6.2.4 Contact Current Rating (EIA 364-70, Method 2) ...........5-53
5.7 Mechanical and Environmental Requirements.......................................................5-53
5.7.1 Mechanical Requirements ....................................................................5-53
5.7.1.1 Insertion Force (EIA 364-13).........................................5-53
5.7.1.2 Extraction Force (EIA 364-13).......................................5-53
5.7.1.3 Durability or Insertion/Extraction Cycles (EIA 364-09) ..5-53
5.7.1.4 Cable Flexing (EIA 364-41, Condition I)........................5-54
5.7.1.5 Cable Pull-Out (EIA 364-38, Condition A).....................5-54
5.7.1.6 Peel Strength (USB 3.0 Micro Connector
Family Only) ..................................................................5-54
5.7.1.7 4-Axes Continuity Test (USB 3.0 Micro Connector
Family Only) ..................................................................5-54
5.7.1.8 Wrenching Strength (Reference, USB 3.0 Micro
Connector Family Only) ................................................5-56
5.7.1.9 Lead Co-Planarity .........................................................5-56
5.7.1.10 Solderability...................................................................5-56
5.7.1.11 Restriction of Hazardous Substances (RoHS)
Compliance ...................................................................5-56
5.7.2 Environmental Requirements ...............................................................5-56
5.7.3 Materials ...............................................................................................5-57
5.8 Implementation Notes and Design Guides.............................................................5-57
5.8.1 Mated Connector Dimensions ..............................................................5-57
举报

wqxyx

2009-8-3 15:26:40
 不知能否下载，先谢了。
举报

57378

2009-8-4 18:52:31
要金币？
举报

LGK

2009-10-26 14:14:42
怎么要金币呀
举报

1652784388.786100

2009-11-24 19:02:21
 希望能抓阿!!!
枚金幣.....
举报

myedacn

2010-3-24 17:12:33
 怎么要金币呀
举报

cxx

2012-4-20 18:31:02
谢谢了！
举报

h1654155175.8376

2020-9-21 17:24:01
怎么解压文件呢？
举报

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