Wafer Fabrication[晶圆制造]
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晶圆级封装技术,Wafer Level Package Technology

晶圆级封装技术Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devicesInternational Rectifier’s Wafer Level Package (WLP)devices combine the latest die design with newpackaging techniques to occupy the smallestpossible footprints. The first products to use WLPtechnology are the FlipFET? range of HEXFET?Power MOSFET devices, in which a modified diedesign places the drain as well as the gate andsource contacts on the front face of the die. Packagefootprints for these devices are typically one-thirdthose of small outline packages with equivalentperformance.To simplify board mounting and improve reliability,International Rectifier manufactures WLP devices toexacting standards. These high standards haveevolved through evaluating many different materialsand designs. Although such evaluations have yieldedgood results, the recommendations in thisapplication note may need to be adjusted to suitspecific production environments.
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回帖(209)

apingvsyu

2009-6-20 10:48:18
来学习啦
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diamondzeng

2009-6-26 16:56:57
学习一下
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sanfeng168

2009-7-28 15:10:53
现下下来看
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psliu

2009-8-22 10:59:11
哈哈, 不错
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aduktxj

2009-9-14 03:26:22
好东西正要学习下,谢谢啦
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allenwei1218

2009-12-3 15:29:06
学些下
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greenkxg

2010-1-11 17:24:47
学习ing
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shanda491837

2010-1-27 09:04:22
请问请问千万
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83471

2010-2-11 13:27:33

哪来的????

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haifeisi

2010-4-30 11:22:55
回帖看文 天经地义 呵呵
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颜鑫

2010-5-10 22:22:12
谢谢楼主
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szallenzhang

2010-5-14 09:11:44
学习中
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mcu510

2010-5-14 10:36:51
学写学习好
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zhouchengxin

2010-6-29 14:16:44
学习
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shchx

2010-7-7 16:50:40
学点东东不容易啊
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yuhou106

2010-7-27 10:04:43
来学习下知识
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leijun

2010-7-28 14:09:47
新手上路!谢谢指教!
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龙行天

2010-7-29 13:22:23
怎么下载不了?????
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wszhcn

2010-8-17 12:52:08
good
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