ipc标准目录

电子工程师 2008-09-04 8373

工艺综述

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描述

ipc标准目录

电子组装（Assembly）

IPC-T-50F

Terms and Definition for Interconnecting and Packaging Electronic Circuits
电子威廉希尔官方网站互连与封装的定义和术语

IPC-S-100

Standards and Specifications Manual
标准和详细说明汇编手册

IPC-S-100

Test Methods Manual
试验方法手册

IPC/EIA J-STD-001C

Requirements for Soldered Electrical & Electronic Assemblies
电气与电子组装件锡焊要求

IPC-HDBK-001

Handbook and Guide to Supplement J-STD-001—Includes Amendment 1
J-STD-001辅助手册及指南及修改说明1

IPC-A-610C

Acceptability of Electronic Assemblies
印制板组装件验收条件

IPC/WHMA-A-620

Requirements and Acceptance for Cable and Wire Harness Assemblies
电缆和引线贴装的要求和验收

IPC/EIA J-STD-012

Implementation of Flip Chip and Chip Scale Technology
倒装芯片及芯片级封装技术的应用

IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation
芯片直装技术实施导则

IPC/EIA J-STD-026

Semiconductor Design Standard for Flip Chip Applications
倒装芯片用半导体设计标准

IPC/EIA J-STD-028

Performance Standard for Construction of Flip Chip and Chip Scale Bumps
倒装芯片及芯片级凸块结构的性能标准

J-STD-013

Implementation of Ball Grid Array and Other High Density Technology
球栅阵列 (BGA)及其它高密度封装技术的应用

IPC-7095

Design and Assembly Process Implementation for BGAs
球栅阵列的设计与组装过程的实施

IPC-MC-790

Guidelines for Multichip Module Technology Utilization
多芯片组件技术应用导则

IPC-M-108

Cleaning Guides and Handbook Manual
清洗导则和手册

IPC-CH-65A

Guidelines for Cleaning of Printed Boards & Assemblies
印制板及组装件清洗导则

IPC-SA-61

Post Solder Semi-aqueous Cleaning Handbook
锡焊后半水溶剂清洗手册

IPC-AC-62A

Aqueous Post Solder Cleaning Handbook
锡焊后水溶液清洗手册

IPC-9201

Surface Insulation Resistance Handbook
表面绝缘电阻手册

IPC-M-109

Component Handling Manual
元件处理手册

IPC/JEDEC J-STD-020B

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
非密封固态表面贴装器件湿度／再流焊敏感度分类

IPC/JEDEC J-STD-033A

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用

IPC/JEDEC J-STD-035

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
非气密封装电子元件用声波显微镜

IPC-M-103

Standards for Surface Mount Assemblies Manual
所有SMT标准合订本

IPC-M-104

Standards for Printed Board Assembly Manual
10种常用印制板组装标准合订本

IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting
以表面安装为主的元件封装及互连导则

IPC-SM-785

Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
表面安装焊接件加速可靠性试验导则

IPC-7525

Stencil Design Guidelines
网版设计导则

IPC/EIA J-STD-004

Requirements for Soldering Fluxes-Includes Amendment 1
锡焊焊剂要求（包括修改单1）

IPC/EIA J-STD-005

Requirements for Soldering Pastes-Includes Amendment 1
焊膏技术要求（包括修改单1）

IPC/EIA J-STD-006A

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求

IPC-SM-817

General Requirements for Dielectric Surface Mounting Adhesives
表面安装用介电粘接剂通用要求

IPC-CA-821

General Requirements for Thermally Conductive Adhesives
导热胶粘剂通用要求

IPC-3406

Guidelines for Electrically Conductive Surface Mount Adhesives
表面贴装导电胶使用指南

IPC-3408

General Requirements for Anisotropically Conductive Adhesives Films
各向异性导电胶膜的一般要求

IPC-CC-830B

Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
印制板组装电气绝缘性能和质量手册

IPC-SM-840C

Qualification and Performance of Permanent Solder Mask - Includes Amendment 1
永久性阻焊剂的鉴定及性能(包括修改单1)

IPC-7530

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
大规模焊接(回流焊与波峰焊)过程温度曲线指南

IPC-9701

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
表面安装锡焊件性能试验方法与鉴定要求

IPC-S-816

SMT Process Guideline & Checklist
表面安装技术过程导则及检核表

IPC-CM-770D

Component Mounting Guidelines for Printed Boards
印制板元件安装导则

IPC-7912

Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies
印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算

IPC-9261

In-Process DPMO and Estimated Yield for PWAs
印制板组装过程中每百万件缺陷数(DPMO)及合格率估计

IPC-9501

PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价

IPC-9502

PWB Assembly Soldering Process Guideline for Electronic Components
电子元件的印制板组装焊接过导则

IPC-9503

Moisture Sensitivity Classification for Non-IC Components
非集成威廉希尔官方网站元件的湿度敏感度分级

IPC-9504

Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
非集成威廉希尔官方网站元件的组装过程模拟评价（非集成威廉希尔官方网站元件预处理）

IPC-7711/21 7711 & 7721

Package
合订本

IPC-7711

Rework of Electronic Assemblies
电子组装件的返工

IPC-7721

Repair and Modification of Printed Boards and Electronic Assemblies
印制板和电子组装件的修复与修正

IPC/EIA J-STD-002B

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验

IPC/EIA J-STD-003

Solderability Tests for Printed Boards
印制板可焊性试验

设计（Design）

IPC-M-106

Technology Reference for Design Manual
威廉希尔官方网站手册

IPC-2220

Design Standard Series
设计标准系列手册

IPC-2221A

Generic Standard on Printed Board Design
印制板设计通用标准

IPC-2222

Sectional Standard on Rigid Organic Printed Boards
刚性有机印制板设计分标准

IPC-2223

Sectional Design Standard for Flexible Printed Boards
挠性印制板设计分标准

IPC-2224

Sectional Standard of Design of PWB for PC Card
PC卡用印制威廉希尔官方网站板分设计分标准

IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
有机多芯片模块(MCM-L)及其组装件设计分标准

IPC-SM-782A

Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2
表面安装设计及连接盘图形标准(包括修订1和2)

IPC-D-859

Design Standard for Thick Film Multilayer Hybrid Circuits
厚膜多层混合威廉希尔官方网站设计标准

IPC-1902

IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制威廉希尔官方网站网格体系

IPC-2615

Printed Board Dimensions and Tolerances
印制板尺寸和公差

IPC-D-322

Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
使用标准在制板尺寸的印制板尺寸选择指南

IPC-2531

Standard Recipe File Format Specification
SMEMA发布：标准“菜单”（过程控制）文件格式规范
注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC}

IPC-2541

Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication
电子制造车间现场设备信息沟通(CAMX)通用要求

IPC-2546

Sectional Requirements for Specific Printed Circuit Board Assembly Equipment
特殊印制板组装设备分要求

IPC-2571

Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
电子制造供应链信息沟通分要求 产品数据交换

IPC-2511A

Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology
实施产品制造数据描述及其传输方法学的通用要求

IPC-D-356B

Bare Board Electrical Test Data Format
裸基板电检测的数据格式

印制电路板
（Printed Circuit Boards）

IPC-M-105

Rigid Printed Board Manual
刚性印制板设计手册

IPC-D-325A

Documentation Requirements for Printed Boards 印制板设计文件图册要求

IPC-PE-740A

Troubleshooting for Printed Board Manufacture and Assembly
印制板制造和组装的故障排除

IPC-6010 Series

IPC-6010 Qualification and Performance Series
IPC-6010印制威廉希尔官方网站板质量标准和性能规范系列手册

IPC-6011

Generic Performance Specification for Printed Boards
印制板通用性能规范

IPC-6013-K

Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1）

IPC-6016

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范

IPC-6012A-AM

Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1)

IPC-6018A

Microwave End Product Board Inspection and Tech
微波成品印制板的检验和测试

IPC-6015

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections
有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范

IPC-A-600F

Acceptability of Printed Boards
印制板验收条件

IPC-HM-860

Specification for Multilayer Hybrid Circuits
多层混合威廉希尔官方网站规范

IPC-TF-870

Qualification and Performance of Polymer Thick Film Printed Boards
聚合物厚膜印制板的鉴定与性能

IPC-ML-960

Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范

IPC-DR-572

Drilling Guidelines for Printed Boards
印制板钻孔导则

IPC-NC-349

Computer Numerical Control Formatting for Drillers and Routers
钻床和铣床用计算机数字控制格式

IPC-SM-839

Pre & Post Solder Mask Application Cleaning Guidelines
施加阻焊前及施加后清洗导则

IPC/JPCA-4104

Specification for High Density Interconnect (HDI) and Microvia Materials
高密度互连(HDI)及微导通孔材料规范

IPC-6016

Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
高密度互连(HDI)层或印制板的鉴定与性能规范

IPC/JPCA-6801

IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection
积层/高密度互连的术语和定义、试验方法与设计例

IPC-DD-135

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
多芯片组件内层有机绝缘材料的鉴定试验

IPC-4103

Specification for Base Materials for High Speed/High Frequency Applications
高速高频用基材规范

IPC-6018A

Microwave End Product Board Inspection and Test
微波成品印制板的检验和测试

IPC-D-317A

Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
采用高速技术电子封装设计导则

IPC-M-102

Flexible Circuits Compendium
挠性威廉希尔官方网站纲要

IPC-4202

Flexible Base Dielectrics for Use in Flexible Printed Circuitry
挠性印制线路用挠性绝缘基底材料

IPC-4203

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
挠性印制线路覆盖层用涂粘接剂绝缘薄膜

IPC-4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
挠性金属箔去电应用于柔性威廉希尔官方网站组装

IPC-6013-K

Qualification & Performance Specification for Flexible Printed Boards & Amendment 1
挠性印制板的鉴定与性能规范（包括修改单1）

IPC/JPCA-6202

IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC/JPCA单双面挠性印制板性能手册

IPC-FC-234

Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范

IPC-M-107

Standards for Printed Board Materials Manual 印制板材料标准手册

IPC-4101A

Specifications for Base Materials for Rigid and Multilayer Printed Boards
刚性及多层印制板用基材规范

IPC-4121

Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则

IPC-4562

Metal Foil for Printed Wiring Applications
印制线路用金属箔

IPC-CF-148A

Resin Coated Metal for Printed Boards
印制板用涂树脂金属箔

IPC-CF-152B

Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范

IPC-4412

Specification for Finished Fabric Woven from ”E” Glass for Printed Boards
“E”类精纺玻璃纤维层印制板技术规范

IPC-4130

Specification & Characterization Methods for Nonwoven "E" Glass Materials
E 玻璃纤维非织布材料规范及性能确定方法

IPC-4110

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
印制板用纤维纸规范及性能确定方法

IPC-4411-K

Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1
聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1

IPC-4411-AM1

Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1
关于聚芳基酰胺非织布规范及性能确定方法的修改单 1

IPC-SG-141

Specification for Finished Fabric Woven from "S" Glass for Printed Boards
印制板用经处理S玻璃纤维织物规范

IPC-A-142

Specification for Finished Fabric Woven from Aramid for Printed Boards
印制板用经处理聚芳酰胺纤维编织物规范

IPC-QF-143

Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
印制板用经处理石英（熔融纯氧化硅）纤维编织物规范

IPC-2524

PWB Fabrication Data Quality Rating System
印制板制造数据质量定级体系

IPC-9191

General Guidelines for Implementation of Statistical Process Control (SPC)
实施统计过程控制(SPC)的通用导则

IPC-9252

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
未组装印制板电测试要求和指南

IPC-MS-810

Guidelines for High Volume Microsection
大批量显微剖切导则

IPC-QL-653A

Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
印制板、元器件及材料检验试验设备的认证

IPC-TR-486

Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation
内层分离的互连应力测试(IST)与显微剖切相关性联合研究

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