半导体分立器件AEC-Q101认证试验

型号: JESD22-A113
品牌: GRGTEST(广电计量)

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服务介绍

随着技术的进步,各类半导体功率器件开始由实验室阶段走向商业应用,尤其以SiC为代表的第三代半导体器件国产化的脚步加快。但车用分立器件市场均被国外巨头所把控,国产器件很难分一杯羹,主要的原因之一即是可靠性得不到认可。

 

测试周期:

2-3个月,提供全面的认证计划、测试等服务

产品范围:

二、三极管、晶体管、MOS、IBGT、TVS管、Zener、闸流管等半导体分立器件

测试项目:

序号测试项目缩写样品数/批批数测试方法
1Pre- and Post-Stress Electrical and Photometric TestTEST所有应力试验前后均进行测试用户规范或供应商的标准规范
2Pre-conditioningPCSMD产品在7、8、9和10试验前预处理JESD22-A113
3External VisualEV每项试验前后均进行测试JESD22-B101
4Parametric VerificationPV253 Note A用户规范
5High Temperature
Reverse Bias
HTRB773 Note BMIL-STD-750-1
M1038 Method A
5aAC blocking
voltage
ACBV773 Note BMIL-STD-750-1
M1040 Test Condition A
5bHigh Temperature
Forward Bias
HTFB773 Note BJESD22
A-108
5cSteady State
Operational
SSOP773 Note BMIL-STD-750-1
M1038 Condition B(Zeners)
6High Temperature
Gate Bias
HTGB773 Note BJESD22
A-108
7Temperature
Cycling
TC773 Note BJESD22
A-104
Appendix 6
7aTemperature
Cycling Hot Test
TCHT773 Note BJESD22
A-104
Appendix 6
7a
alt
TC Delamination
Test
TCDT773 Note BJESD22
A-104
Appendix 6
J-STD-035
7bWire Bond IntegrityWBI53 Note BMIL-STD-750
Method 2037
8Unbiased Highly
Accelerated Stress
Test
UHAST773 Note BJESD22
A-118
8
alt
AutoclaveAC773 Note BJESD22
A-102
9Highly Accelerated
Stress Test
HAST773 Note BJESD22
A-110
9
alt
High Humidity
High Temp.
Reverse Bias
H3TRB773 Note BJESD22
A-101
10Intermittent
Operational Life
IOL773 Note BMIL-STD-750
Method 1037
10
alt
Power and
Temperature Cycle
PTC773 Note BJESD22
A-105
11ESD
Characterization
ESD30 HBM1AEC-Q101-001
30 CDM1AEC-Q101-005
12Destructive
Physical Analysis
DPA21 NoteBAEC-Q101-004
Section 4
13Physical
Dimension
PD301JESD22
B-100
14Terminal StrengthTS301MIL-STD-750
Method 2036
15Resistance to
Solvents
RTS301JESD22
B-107
16Constant AccelerationCA301MIL-STD-750
Method 2006
17Vibration Variable
Frequency
VVF项目16至19是密封包装的顺序测试。 (请参阅图例页面上的注释H.)JEDEC
JESD22-B103
18Mechanical
Shock
MS  JEDEC
JESD22-B104
19HermeticityHER  JESD22-A109
20Resistance to
Solder Heat
RSH301JESD22
A-111 (SMD)
B-106 (PTH)
21SolderabilitySD101 Note BJ-STD-002
JESD22B102
22Thermal
Resistance
TR101JESD24-3,24-4,26-6视情况而定
23Wire Bond
Strength
WBS最少5个器件的10条焊线1MIL-STD-750
Method 2037
24Bond ShearBS最少5个器件的10条焊线1AEC-Q101-003
25Die ShearDS51MIL-STD-750
Method 2017
26Unclamped
Inductive
Switching
UIS51AEC-Q101-004
Section 2
27Dielectric IntegrityDI51AEC-Q101-004
Section 3
28Short Circuit
Reliability
Characterization
SCR103 Note BAEC-Q101-006
29Lead FreeLF  AEC-Q005