DDR2 usage is common today with a push towards higher speeds such as 800 Mbps [1] and more recently,
1066 Mbps. DDR3 [2] targets a data rate of 1600 Mbps. From a PCB implementation standpoint, a primary
requirement is delay matching which is dictated by the timing requirement. This brings into it a number of related
factors that affect waveform integrity and delay. These factors are interdependent, but where a distinction can
be made, they can be termed PCB layer stackup and impedance, interconnect topologies, delay matching, cross
talk, PI and timing. Cadence ALLEGRO™SI-230 and Ansoft’s HFSS™ are used in all computations.
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