A circuits become faster, more concern needs to be focused on packaging and interconnects in order to fully utilize device performance. One area of concern is with the package leads between the chip and the board environment. The current flowing into or out of an integrated circuit is conducted through a lead frame trace and bonding wire connecting the integrated circuit to outside circuitry. these leads are circuit elements, inductors, and have a definite effect on the circuit performance because they generate noise in high-speed applications. Inductance is the measure of change in the magnetic field surrounding a conductor resulting form the variation of the current flowing through the conductor. The change in current through the inductor induces a counter electromotive force, EMF, which opposes that change in current.