PCB多层板对准度控制设计 （英文）
How does one optimize the multilayer fabrication process for best registration of layers and drill
patterns? As advances in all aspects of circuit and component technology increase the density of
interconnections, more accurate means of layer registration are required. At these densities, the
accumulated errors - from plotter calibration and film stability - from artwork and post etch tooling -
especially from lamination - and also from drilling - require careful attention to maintain yields at a
profitable level.
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