如何避免有限地平面的背辐射？

> {quote：title = Boss写道：} {quote}>嗨..我正在研究微带贴片天线。
为获得有限的地平面，我将导体2作为铜。
端口1连接到贴片（导体-1）。
和端口2连接到cond.2。
您的模型看起来正确。
>当我试图获得E平面图案时（因为theta变化＆amp; phi为零）。
我也在背后得到辐射。
如何避免有限地平面的背辐射？
看你的情节中的比例：后叶比主瓣低20dB。
看起来很好。
一些背面辐射是真实的，因为有限的地平面不能完全屏蔽背面。



     以下为原文

  > {quote:title=Boss wrote:}{quote}
> Hi.. I am working on microstrip patch antenna. To get finite ground plane i have conductor 2 as copper. Port 1 is connected to patch(conductor-1). and port 2 is connected to cond.2. 

Your model looks correct.

> When i try to get  E-plane pattern(as theta varies & phi is zero). i am getting radiation in back side also. how to avoid back radiation with finite ground plane?

Look at the scale in your plot: the back lobe is 20dB lower than the main lobe. Looks fine to me. Some back side radiation is real, because the finite ground plane does not completely shield the back side.

谢谢。
我还有两个疑问。
1.在底层下面有地面覆盖物选项。
这意味着无限的地平面？
我在学院里有2012.08。
有两个导体层可用。
我该如何设计多层天线设计？
那可能吗？



     以下为原文

  Thanks. I have two more doubts.
1. Below the substrate layer ground cover option is there. Is that means infinite ground plane?
2. I have 2012.08 in my institute. There are two conductor layers available. How can i design multi layer antenna design? is that possible?

> {quote：title = Boss写道：} {quote}> 1.底座层底盖选项就在那里。
这意味着无限的地平面？
在您显示的基材中，基材上方和下方有空气（开放）。
没有无限的地平面。
这是对的。
> 2.我在学院有2012.08。
有两个导体层可用。
我该如何设计多层天线设计？
那可能吗？
你想要的层数一样多。
您可以使用cond和cond2，但您也可以使用其他图层，如pc1，pc2，...图层的功能取决于您在基材中如何使用（绘图）它。
对于更多导体层，将图层映射为导体层。
过孔相同。
图层名称只是一个名称，并不重要。
重要的是如何在基材中使用该层。



     以下为原文

  > {quote:title=Boss wrote:}{quote}
> 1. Below the substrate layer ground cover option is there. Is that means infinite ground plane?

In the substrate that you show, there is air (open) above and below the substrate. No infinite ground plane. This is correct.

> 2. I have 2012.08 in my institute. There are two conductor layers available. How can i design multi layer antenna design? is that possible?

There are as many layers as you want. You can use cond and cond2, but you can also use other layers, like pc1, pc2, ... 
The function of the layer depends on how you use (map) it in the substrate. For more conductor layers, map the layers as conductor layers. Same for vias. The layer name is only a name, and does not matter. What matters is how you use the layer in the substrate.

谢谢



     以下为原文

  Thank you